"Large-area photo-patterning of initially conductive EGaIn particle-assembled film for soft electronics"
G. H. Lee†, H. Kim†, J. Lee, J. Y. Bae, C. Yang, H. Kim, H. Kang, S. Q. Choi, S. Park, S. K. Kang, J. Kang, Z. Bao, J. W. Jeong*, Steve Park*, Materials Today, 2023,