"Reduction of appearance artifacts in wearableon- skin electronics"

Y. Liu, S. Ito, T. Kato, L. Wang, Y. Zhu, S. D. Mulatier, H. Arao, S. Suwazono, H. Asano, Y. Zhou, H. Mitomo, H. Gong, O. Nomura, G. Kagawa, N. Watanabe, M. H. Behfar, Y. Kuroiwa, T. Tatsuma, Y. Sugano, H. Takahashi, M. Asai, J. Kang, N. Matsuhisa, Science Advances, 2026,

"A disulfide–Fe3+ crosslinking strategy for tough hydrogel networks with complete photo- and biochemical degradability"

Y. B. Yoon, N. Kim, H. Jung, Y. Ko, C. Kang, J. Chong, J. Kang, D. Kang, J.-B. Chang, Materials Horizons, 2026,

"Laser-induced polymer dynamics and applications"

D. Won, J. Ahn, J. Chong, A. Cho, T. Kim, S.H. Choi, D.G. Seo*, J. Kang*, S. H. Ko*, Chemical Society Reviews, 2026, 55,

"Photoactivable Surfactant Design for In Situ Stabilization of Hydrogel Bioelectronics"

S. Lee, D. Lee, S. Lee, Y. Lee, J. Chong, G. Chang, H. Kim, A. Kim, K. Kim, J. Koo, H. Lee*, J. Kang*, Advanced Materials, 2026,

"Design guidelines for self-healing materials in soft electronics"

C.B. Park, G. Chang, J. Chong, J.Kang* , Nano Convergence, 2026, 13,

"A Cryoprotectant-Compatible Nanoporous Platform for Stable and Scalable Delivery of Biopharmaceuticals"

S. Lee, S. Kim, J. Chong, M.-G. Kim, K. Lim, N.-E. Lee, J. Koo, J. Kang*, H. Lee*, Advanced Materials, 2026, e10532

"Abrasion-resistant on-skin electrodes by high-toughness and skin-conformable elastomeric substrates"

Y. Liu, Y. Zhu, H. Gong, L. Wang, J. Chong, J. Kang, N. Matsuhisa*, Applied Physics Express, 2026, 19 (3), 031001

"Supramolecular Nanostructures Enabling Mechanical Reinforcement and Recognitive Self-Healing in Elastomers"

H. Park, H. Lee, Y. Kim, H. Kim, J. Kim, E. Zhao, A. Figueroa, D. Lee*, Z. Bao*, J. Kang*, Advanced Functional Materials, 2025,

"Sealing stretchable electronics through a viscoplastic surface effect"

H. Lee, J. Kang*, Nature materials, 2025,

"Thermally Drawn Multifunctional All-Hydrogel Fibers for Anti-Fibrotic and Multimodal Neural Interfaces"

C. Sung, K.S. Nam, Y. Kim, H. Kang, K.Kim, C. Yoon, S. Lee, A. Chung, J. Kang, Y-G. Park, A.J. Park, H. Butt, H. Yuk, S. Park*, Advanced Materials, 2025,

"Dynamic Bond Chemistry in Soft Materials: Bridging Adaptability and Mechanical Robustness"

H.Lee, J. Kim, M. Lee, J. Kang*, Chemical Reviews, 2025,

"Meter-scale heterostructure printing for high-toughness fiber electrodes in intelligent digital apparel"

G.-H. Lee, Y. Lee, H. Seo, K. Jo, J. Yeo, S. Kim, J.-Y. Bae, C. Kim, C. Majidi, J. Kang, S.-K. Kang, S. Ryu, S. Park*, Nature Communications, 2025, 16, 4320

"Self-packaged stretchable printed circuits with ligand-bound liquid metal particles in elastomer"

H. Seo, G.-H. Lee, J. Park, D.-Y. Kim, Y. Son, S. Kim, K. Nam, C. Yang, J. Won, J.-Y. Bae, H. Kim, S.-K. Kang, S. Park, J. Kang*, S. Park*, Nature Communications, 2025, 16, 4944

"Miniature Li+ solvation by symmetric molecular design for practical and safe Li-metal batteries"

J. Jang†, C. Wang† , G. Kang, C. Han, J. Han, J.-S. Shin,  S. Ko , G. Kim, J. Baek, H.-T. Kim , H. Lee, C. B. Park, D.-H. Seo, Y. Li*,  J. Kang *, Nature Energy, 2025,

"Self-healing electronic skin with high fracture strength and toughness"

J. Jung, S. Lee, H. Kim, W. Lee, J. Chong, I. You, J. Kang*, Nature Communications, 2024, 15, 9763